Semiconductor Application - FITOK ALD Series Atomic Layer Deposition Diaphragm Valves

ALD Series

 

Introduction

 

 

Atomic Layer Deposition (ALD) is a method of applying thin films to various substrates with atomic scale precision. As chip node dimensions are continuously shrinking, traditional deposition techniques have reached their limits. Depositing ultra-thin layer at the nanoscale requires Atomic Layer Deposition (ALD) technology, which allows materials to be deposited one atomic layer at a time. ALD series diaphragm valves are used to deliver precise doses of gases during the deposition process used to create semiconductor chips.

 

Features

 

 

  • Ultra long cycle life
  • No dead space in the flow path
  • High Cv consistency and stability
  • Quick response to offer a total opening / closing response time of less than 15 ms
  • ElgStandard and thermal types optional, the thermal type has a working temperature up to 392 °F (200 °C)
  • For the valve fitted with a solenoid valve, the solenoid valve is circularly rotatable along the actuator for easy position adjustment

 

Technical Data

 

 

ALD Series

 

Application

 

 

Suitable for atomic layer deposition (ALD) processes in the following semiconductor fields

 

  • High-K dielectrics and metal gate
  • MEMS
  • Optoelectronic materials and devices
  • Integrated circuit interconnect line diffusion barrier
  • Flat panel display (organic light emitting diode material, OLED)
  • Optical element
  • Solar cell
  • Various types of films (< 100 nm)

 

Please see the product catalog for more information. Should you have any questions, please contact us directly and we will reach you soon.

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