In semiconductor manufacturing, precise cooling systems are essential for most critical equipment. As semiconductor processes are extremely temperature-sensitive, even slight temperature fluctuations can affect chip yield, performance, and reliability.

For example, in plasma etching systems, excessive heat may damage chamber materials and destabilize the process. During thin-film deposition, variations in temperature can alter chemical reaction rates, gas diffusion, and plasma characteristics—resulting in uneven film thickness, inconsistent doping, or unstable etching rates. Therefore, such high-temperature equipment is typically equipped with complex and precise cooling circulation systems to efficiently cool reaction chambers and other modules.

Hoses and quick-connects are the main components of these systems. Coolant flows through hoses and is routed via quick-connects to the required modules (see Figure 1). Common coolants include water, ethylene glycol, and electronic fluorinated fluids. Efficient coolant delivery and leak prevention are critical challenges in these applications.

Figure 1 Hoses and Quick-Connects Connecting Process Modules

Customer Challenge: Leaks in Quick-Connects

 

A leading wafer fab encountered a production issue: recurring coolant leaks in thin-film deposition equipment purchased from a renowned international semiconductor equipment manufacturer. The equipment used ethylene glycol as the coolant, with the cooling system operating in a high-temperature range of 80–100°C. After extended operation, sudden leaks occurred at the quick-connects. The sporadic and unpredictable nature of the failures made it difficult for engineers to implement an effective preventive maintenance (PM) plan. Coolant leaks not only compromised the cleanroom environment, posing environmental, health, and safety (EHS) risks, but also triggered high-temperature alarms in the equipment. Persistent failures could lead to downtime, severely impacting equipment reliability, safety, and process stability. The existing countermeasure—frequent replacement of quick-connects—failed to fully resolve the issue, causing repeated disruptions and contributing to a high total cost of ownership (TCO).

Our investigation revealed that the leakage in the customer's quick-connects were primarily caused by failure of the O-ring sealing elements. O-rings are commonly used as sealing elements in quick-connects due to their reliable performance and ease of installation. However, in applications involving coolants—particularly ethylene glycol or fluorinated fluids—rubber-based O-ring materials can undergo accelerated aging and degradation. This may result in shortened service life and a higher risk of leakage. Faced with this predicament, the client ultimately turned to FITOK for a solution.

FITOK’s Innovative Solution: Breakthrough in PTFE-Sealed Quick-Connects

 

To address the issue, FITOK conducted a detailed failure analysis and leveraged its expertise in semiconductor fluid systems to propose a solution using its QTM Series PTFE-Sealed Quick-Connects. Compared to the original products used by the customer, the QTM series offers the following advantages in this operating condition:

1. Sealing Material: PTFE Seals Replaces Rubber O-Rings

Corrosion Resistance: PTFE exhibits excellent chemical compatibility and can withstand most chemical substances. PTFE resists corrosion from most strong acids, bases, and organic solvents, remaining stable even under extreme conditions.

Self-Lubricating Properties: Low friction coefficient reduces wear and extends connector lifespan.

2. Structural Optimization and Ease of Use

Double End Shut-Off: Specially designed to minimize gas inclusion and spillage.

Foolproof mechanical design: QTM series keyed quick-connects, available in various color options, prevent accidental mixing of different working lines in actual working conditions (see Figure 2).

Figure 2 Keyed QTM Series Quick-Connects

Safety and Convenience: Push-to-connect design enables quick and easy operation. Locking dog mechanism with large contact area retains stem, preventing accidental disconnection.

3. Precision Compatibility and Rapid Delivery

Precision Compatibility: Customized based on existing end connection types, eliminating the need for full pipeline system modifications and offering direct compatibility for existing pipelines. Figure 3 illustrates part of port configurations available for the QTM series. For additional port options, refer to the QTM Series PTFE-Sealed Quick-Connects Catalog.

Figure 3 QTM Series Offers Various End Connection Types

Rapid Delivery: FITOK’s flexible manufacturing system, mature supply chain, and extensive inventory enable cost savings and quick delivery. Figure 4 highlights FITOK’s readily available large inventory.

Figure 4 FITOK’s Extensive Inventory

Customer Value: Multidimensional Benefits from Cost Control to Productivity Improvement

 

The customer conducted long-term, on-machine testing of FITOK’s solution. The QTM series quick-connects effectively resolved the sporadic coolant leakage issues, enabling extended PM cycles and preventing unplanned downtime that could disrupt production. Additionally, the QTM series has been widely adopted by leading wafer fabs in multiple countries operating under similar conditions , with stable demand and supply well established.

As a manufacturer of valves and fittings, FITOK not only delivers standardized products for wafer fabs and OEMs but also provides in-depth failure analysis and customized solutions tailored to specific customer needs—addressing pain points and delivering lasting value to the semiconductor industry. For more information, please contact FITOK or an authorized distributor.