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FITOK Glossary of Common Abbreviations

FITOK Glossary of Common Abbreviations

 

FITOK products are widely used across global industries, including semiconductor, hydrogen, oil and gas, chemical, power, and liquid cooling. These industries involve a wide range of specialized technical terminology, much of which is commonly expressed through English abbreviations. To help customers and partners better understand these terms and facilitate efficient and accurate technical communication, we have compiled this glossary of commonly used technical abbreviations for reference.

 

 
Abbreviation Full Term Definition
ALD Atomic Layer Deposition A thin-film deposition process that deposits material one atomic layer at a time. It is widely used in semiconductor and microelectronics manufacturing.
ALE Atomic Layer Etching A highly precise etching process that removes material one atomic layer at a time. It is generally regarded as the reverse process of ALD.
AOD Argon Oxygen Decarburization A stainless steel refining process that reduces carbon content by blowing a mixture of argon and oxygen while minimizing alloy loss.
BA Bright Anneal A heat treatment process performed in a protective atmosphere to produce a bright, oxide-free metal surface.
BSPP British Standard Pipe Parallel A British standard 55° parallel pipe thread that typically seals with a gasket or O-ring rather than the threads themselves.
BSPT British Standard Pipe Taper A British standard 55° tapered pipe thread that achieves sealing through thread interference.
CDA Clean Dry Air Oil-free, moisture-free, highly filtered compressed air used in semiconductor, pharmaceutical, and other clean manufacturing processes.
CFOS Clean for Oxygen Service Indicates that a product has been specially cleaned to remove contaminants that could create fire or explosion hazards in oxygen service.
CHSS Compressed Hydrogen Storage System Equipment or systems designed for storing compressed hydrogen in hydrogen energy applications.
CPT Critical Pitting Temperature The lowest temperature at which stable pitting corrosion initiates under specified test conditions. It is an important indicator of a material's pitting corrosion resistance.
CVD Chemical Vapor Deposition A process that deposits solid thin films through chemical reactions of gaseous precursors on a substrate surface. It is widely used in the semiconductor, photovoltaic, and surface coating industries.
DESO Double-End Shutoff Both the female end (body) and male end (stem) of the coupling are equipped with self-closing valves, allowing fluid flow on both sides to be shut off simultaneously when disconnected.
EP Electropolish An electrochemical finishing process that improves surface smoothness, cleanliness, and corrosion resistance.
ESR Electroslag Remelting A remelting process that improves material cleanliness, microstructure, and mechanical properties.
FLNG Floating Liquefied Natural Gas Facility An offshore floating facility integrating natural gas production, liquefaction, storage, and offloading.
FPSO Floating Production Storage and Offloading An offshore floating production facility that integrates oil production, storage, and offloading functions.
HPU Hydraulic Power Unit A system that supplies pressurized hydraulic fluid to hydraulic equipment, typically consisting of a reservoir, hydraulic pump, motor, and valve manifold.
IGS Integrated Gas System An integrated system used to control gas in the semiconductor industry, integrating valves, fittings, and other piping components, as well as other necessary measuring and control instruments.
LOTO Lockout & Tagout A safety procedure used to prevent accidental operation or unintended startup of equipment that has been shut down.
LRV Log Reduction Value A logarithmic measure of filtration efficiency. For example, a 99.9999% removal efficiency equals 6 LRV.
MP Mechanical Polish A mechanical finishing process used to reduce surface roughness and improve surface finish.
NPT National Pipe Thread A U.S. standard 60° tapered pipe thread typically used with thread sealant or PTFE tape.
OS&Y Outside Screw and Yoke A valve design with an externally threaded rising stem supported by a yoke, commonly used in gate and globe valves.
POU Point of Use The location where gases, fluids, or chemicals are ultimately delivered for consumption by equipment or processes.
ppm Parts Per Million A concentration unit representing one part per million parts of a substance.
PREN Pitting Resistance Equivalent Numbers A calculated index based primarily on chromium, molybdenum, and nitrogen contents that estimates the pitting corrosion resistance of stainless steels. Higher PREN values generally indicate better resistance.
PSI Pounds per Square Inch An imperial unit of pressure.
PSIA Pounds per Square Inch Absolute Pressure referenced to absolute vacuum.
PSID Pounds per Square Inch Differential The pressure difference between two measurement points.
PSIG Pounds per Square Inch Gauge Pressure measured relative to atmospheric pressure.
PVD Physical Vapor Deposition A process in which materials are deposited onto a substrate surface through physical methods such as evaporation and sputtering to form a thin film. It is widely used for the surface treatment of cutting tools and various molds, as well as in semiconductor equipment manufacturing processes.
SCCS Standard Cubic Centimeters per Second A gas flow unit commonly used to express leak rates under standard reference conditions.
SCFM Standard Cubic Feet per Minute A gas flow rate expressed in standard cubic feet per minute under specified reference conditions. SEMI F101 defines the standard condition as 0°C and 101.3 kPa.
SESO Single-End Shutoff A quick disconnect design in which only one side automatically closes upon disconnection.
SLPM Standard Liters per Minute A gas flow rate expressed in standard liters per minute under specified reference conditions. SEMI F101 defines the standard condition as 0°C and 101.3 kPa.
SPE Supply Pressure Effect The degree to which changes in inlet pressure affect the outlet set pressure of a pressure regulator, and an important indicator of regulator performance.
UHP Ultra High Purity Refers to extremely high-purity gases, fluids, or systems used in semiconductor, photovoltaic, pharmaceutical, and other contamination-sensitive industries.
UHP Ultra High Pressure Refers to fluid systems operating at pressures significantly higher than conventional industrial pressure ranges.
UQD Universal Quick Disconnect A tool-free quick disconnect coupling designed primarily for liquid cooling systems.
UQDB Universal Quick Disconnect Blind-Mate A quick disconnect coupling featuring a blind-mating design with self-alignment functionality, ideal for applications with limited space, restricted visibility, or hard-to-reach locations.
VAR Vacuum Arc Remelting A remelting process in which an electric arc is used as the heat source to remelt metal in a vacuum. Volatile impurities are vaporized and removed, improving material purity, density, and microstructural uniformity.
VCR Vacuum Coupling Radius A metal face-seal connection that has become a standard connection method in semiconductor process systems and provides a versatile connection solution for applications ranging from cryogenic to high-temperature conditions and from high vacuum to high pressure.
VIM Vacuum Induction Melting A melting process in which metal is melted by electromagnetic induction in a vacuum. Impurities with higher vapor pressures than the base metal at the melting temperature can be removed through volatilization, thereby improving material purity.
VMB Valve Manifold Box A gas distribution enclosure integrating valves, regulators, filters, and monitoring devices, commonly used for hazardous specialty gases.
VMP Valve Manifold Panel A valve control panel used to distribute and control process gases in centralized gas supply systems.
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